Wollastonite powder has shown significant application potential in the field of electronic packaging materials, mainly due to its unique physical and chemical properties, such as high insulation, low dielectric constant, good thermal stability, and needle like structure. These characteristics make it a key functional filler for high-performance electronic packaging materials.
In electronic packaging, wollastonite powder is often used as a filling material for epoxy potting adhesives and other systems. By adding wollastonite powder, the dielectric properties, mechanical strength, heat resistance, flame retardancy, and wear resistance of the material can be improved. Its needle like structure can form cross stacking with spherical fillers (such as silica), reducing the porosity of composite materials, thereby improving heat dissipation performance and reducing safety risks caused by overheating in electronic products. In addition, the low specific gravity of wollastonite powder helps to reduce the overall weight of packaging materials while maintaining performance, providing support for lightweight design.
With the development of electronic devices towards miniaturization and high integration, the comprehensive performance requirements for packaging materials are increasingly increasing. The chemical stability, durability, and enhancement effect of wollastonite powder make it have broad prospects in meeting these needs. In the future, optimizing the compatibility between wollastonite powder and organic matrix through surface modification technology is expected to further expand its application in the field of high-end electronic packaging.